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Perspective method for regeneration of spent solutions from printed circuit boards etching. / Makovskaia, O. Yu; Shevchuk, A. P.; Anikin, Y. V.
Materials Science and Metallurgical Technology II. ред. / Andrey A. Radionov. Trans Tech Publications Ltd., 2020. стр. 548-553 (Materials Science Forum; Том 989 MSF).

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Harvard

Makovskaia, OY, Shevchuk, AP & Anikin, YV 2020, Perspective method for regeneration of spent solutions from printed circuit boards etching. в AA Radionov (ред.), Materials Science and Metallurgical Technology II. Materials Science Forum, Том. 989 MSF, Trans Tech Publications Ltd., стр. 548-553, International Russian Conference on Materials Science and Metallurgical Technology, RusMetalCon 2019, Chelyabinsk, Российская Федерация, 01/10/2019. https://doi.org/10.4028/www.scientific.net/MSF.989.548

APA

Makovskaia, O. Y., Shevchuk, A. P., & Anikin, Y. V. (2020). Perspective method for regeneration of spent solutions from printed circuit boards etching. в A. A. Radionov (Ред.), Materials Science and Metallurgical Technology II (стр. 548-553). (Materials Science Forum; Том 989 MSF). Trans Tech Publications Ltd.. https://doi.org/10.4028/www.scientific.net/MSF.989.548

Vancouver

Makovskaia OY, Shevchuk AP, Anikin YV. Perspective method for regeneration of spent solutions from printed circuit boards etching. в Radionov AA, Редактор, Materials Science and Metallurgical Technology II. Trans Tech Publications Ltd. 2020. стр. 548-553. (Materials Science Forum). doi: 10.4028/www.scientific.net/MSF.989.548

Author

Makovskaia, O. Yu ; Shevchuk, A. P. ; Anikin, Y. V. / Perspective method for regeneration of spent solutions from printed circuit boards etching. Materials Science and Metallurgical Technology II. Редактор / Andrey A. Radionov. Trans Tech Publications Ltd., 2020. стр. 548-553 (Materials Science Forum).

BibTeX

@inproceedings{735c584eb9994bdf83b2f1377383d0a0,
title = "Perspective method for regeneration of spent solutions from printed circuit boards etching",
keywords = "Cupric chloride solution, Effluents, Ion exchange, Metal recovery, Printed circuit boards, Recycling, Wastewater",
author = "Makovskaia, {O. Yu} and Shevchuk, {A. P.} and Anikin, {Y. V.}",
year = "2020",
month = jan,
day = "1",
doi = "10.4028/www.scientific.net/MSF.989.548",
language = "English",
isbn = "9783035715767",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd.",
pages = "548--553",
editor = "Radionov, {Andrey A.}",
booktitle = "Materials Science and Metallurgical Technology II",
address = "Switzerland",
note = "International Russian Conference on Materials Science and Metallurgical Technology, RusMetalCon 2019 ; Conference date: 01-10-2019 Through 04-10-2019",

}

RIS

TY - GEN

T1 - Perspective method for regeneration of spent solutions from printed circuit boards etching

AU - Makovskaia, O. Yu

AU - Shevchuk, A. P.

AU - Anikin, Y. V.

PY - 2020/1/1

Y1 - 2020/1/1

KW - Cupric chloride solution

KW - Effluents

KW - Ion exchange

KW - Metal recovery

KW - Printed circuit boards

KW - Recycling

KW - Wastewater

UR - http://www.scopus.com/inward/record.url?scp=85085245795&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/MSF.989.548

DO - 10.4028/www.scientific.net/MSF.989.548

M3 - Conference contribution

AN - SCOPUS:85085245795

SN - 9783035715767

T3 - Materials Science Forum

SP - 548

EP - 553

BT - Materials Science and Metallurgical Technology II

A2 - Radionov, Andrey A.

PB - Trans Tech Publications Ltd.

T2 - International Russian Conference on Materials Science and Metallurgical Technology, RusMetalCon 2019

Y2 - 1 October 2019 through 4 October 2019

ER -

ID: 12926013