Standard

Perspective method for regeneration of spent solutions from printed circuit boards etching. / Makovskaia, O. Yu; Shevchuk, A. P.; Anikin, Y. V.
Materials Science and Metallurgical Technology II. ed. / Andrey A. Radionov. Trans Tech Publications Ltd., 2020. p. 548-553 (Materials Science Forum; Vol. 989 MSF).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Harvard

Makovskaia, OY, Shevchuk, AP & Anikin, YV 2020, Perspective method for regeneration of spent solutions from printed circuit boards etching. in AA Radionov (ed.), Materials Science and Metallurgical Technology II. Materials Science Forum, vol. 989 MSF, Trans Tech Publications Ltd., pp. 548-553, International Russian Conference on Materials Science and Metallurgical Technology, RusMetalCon 2019, Chelyabinsk, Russian Federation, 01/10/2019. https://doi.org/10.4028/www.scientific.net/MSF.989.548

APA

Makovskaia, O. Y., Shevchuk, A. P., & Anikin, Y. V. (2020). Perspective method for regeneration of spent solutions from printed circuit boards etching. In A. A. Radionov (Ed.), Materials Science and Metallurgical Technology II (pp. 548-553). (Materials Science Forum; Vol. 989 MSF). Trans Tech Publications Ltd.. https://doi.org/10.4028/www.scientific.net/MSF.989.548

Vancouver

Makovskaia OY, Shevchuk AP, Anikin YV. Perspective method for regeneration of spent solutions from printed circuit boards etching. In Radionov AA, editor, Materials Science and Metallurgical Technology II. Trans Tech Publications Ltd. 2020. p. 548-553. (Materials Science Forum). doi: 10.4028/www.scientific.net/MSF.989.548

Author

Makovskaia, O. Yu ; Shevchuk, A. P. ; Anikin, Y. V. / Perspective method for regeneration of spent solutions from printed circuit boards etching. Materials Science and Metallurgical Technology II. editor / Andrey A. Radionov. Trans Tech Publications Ltd., 2020. pp. 548-553 (Materials Science Forum).

BibTeX

@inproceedings{735c584eb9994bdf83b2f1377383d0a0,
title = "Perspective method for regeneration of spent solutions from printed circuit boards etching",
keywords = "Cupric chloride solution, Effluents, Ion exchange, Metal recovery, Printed circuit boards, Recycling, Wastewater",
author = "Makovskaia, {O. Yu} and Shevchuk, {A. P.} and Anikin, {Y. V.}",
year = "2020",
month = jan,
day = "1",
doi = "10.4028/www.scientific.net/MSF.989.548",
language = "English",
isbn = "9783035715767",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd.",
pages = "548--553",
editor = "Radionov, {Andrey A.}",
booktitle = "Materials Science and Metallurgical Technology II",
address = "Switzerland",
note = "International Russian Conference on Materials Science and Metallurgical Technology, RusMetalCon 2019 ; Conference date: 01-10-2019 Through 04-10-2019",

}

RIS

TY - GEN

T1 - Perspective method for regeneration of spent solutions from printed circuit boards etching

AU - Makovskaia, O. Yu

AU - Shevchuk, A. P.

AU - Anikin, Y. V.

PY - 2020/1/1

Y1 - 2020/1/1

KW - Cupric chloride solution

KW - Effluents

KW - Ion exchange

KW - Metal recovery

KW - Printed circuit boards

KW - Recycling

KW - Wastewater

UR - http://www.scopus.com/inward/record.url?scp=85085245795&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/MSF.989.548

DO - 10.4028/www.scientific.net/MSF.989.548

M3 - Conference contribution

AN - SCOPUS:85085245795

SN - 9783035715767

T3 - Materials Science Forum

SP - 548

EP - 553

BT - Materials Science and Metallurgical Technology II

A2 - Radionov, Andrey A.

PB - Trans Tech Publications Ltd.

T2 - International Russian Conference on Materials Science and Metallurgical Technology, RusMetalCon 2019

Y2 - 1 October 2019 through 4 October 2019

ER -

ID: 12926013