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Makovskaya, OY, Shevchuk, A & Sorokinc, SP 2020,
Copper recovery from rinse waters after ammoniac etching of printed circuit boards. в AA Radionov (ред.),
Materials Engineering and Technologies for Production and Processing V. Solid State Phenomena, Том. 299 SSP, Trans Tech Publications Ltd., стр. 998-1004, 5th International Conference on Industrial Engineering,ICIE 2019, Sochi, Российская Федерация,
25/03/2019.
https://doi.org/10.4028/www.scientific.net/SSP.299.998
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BibTeX
@inproceedings{3be87b57d4b54116874f1d3574eec09e,
title = "Copper recovery from rinse waters after ammoniac etching of printed circuit boards",
keywords = "Ammonia, Copper, Ion exchange, Printed circuit boards, Rinse waters",
author = "Makovskaya, {O. Yu} and A. Shevchuk and Sorokinc, {S. P.}",
year = "2020",
month = jan,
day = "1",
doi = "10.4028/www.scientific.net/SSP.299.998",
language = "English",
isbn = "9783035715002",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications Ltd.",
pages = "998--1004",
editor = "Radionov, {Andrey A.}",
booktitle = "Materials Engineering and Technologies for Production and Processing V",
address = "Switzerland",
note = "5th International Conference on Industrial Engineering,ICIE 2019 ; Conference date: 25-03-2019 Through 29-03-2019",
}
RIS
TY - GEN
T1 - Copper recovery from rinse waters after ammoniac etching of printed circuit boards
AU - Makovskaya, O. Yu
AU - Shevchuk, A.
AU - Sorokinc, S. P.
PY - 2020/1/1
Y1 - 2020/1/1
KW - Ammonia
KW - Copper
KW - Ion exchange
KW - Printed circuit boards
KW - Rinse waters
UR - http://www.scopus.com/inward/record.url?scp=85079884225&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/SSP.299.998
DO - 10.4028/www.scientific.net/SSP.299.998
M3 - Conference contribution
AN - SCOPUS:85079884225
SN - 9783035715002
T3 - Solid State Phenomena
SP - 998
EP - 1004
BT - Materials Engineering and Technologies for Production and Processing V
A2 - Radionov, Andrey A.
PB - Trans Tech Publications Ltd.
T2 - 5th International Conference on Industrial Engineering,ICIE 2019
Y2 - 25 March 2019 through 29 March 2019
ER -
