Standard

Copper recovery from rinse waters after ammoniac etching of printed circuit boards. / Makovskaya, O. Yu; Shevchuk, A.; Sorokinc, S. P.
Materials Engineering and Technologies for Production and Processing V. ed. / Andrey A. Radionov. Trans Tech Publications Ltd., 2020. p. 998-1004 (Solid State Phenomena; Vol. 299 SSP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Harvard

Makovskaya, OY, Shevchuk, A & Sorokinc, SP 2020, Copper recovery from rinse waters after ammoniac etching of printed circuit boards. in AA Radionov (ed.), Materials Engineering and Technologies for Production and Processing V. Solid State Phenomena, vol. 299 SSP, Trans Tech Publications Ltd., pp. 998-1004, 5th International Conference on Industrial Engineering,ICIE 2019, Sochi, Russian Federation, 25/03/2019. https://doi.org/10.4028/www.scientific.net/SSP.299.998

APA

Makovskaya, O. Y., Shevchuk, A., & Sorokinc, S. P. (2020). Copper recovery from rinse waters after ammoniac etching of printed circuit boards. In A. A. Radionov (Ed.), Materials Engineering and Technologies for Production and Processing V (pp. 998-1004). (Solid State Phenomena; Vol. 299 SSP). Trans Tech Publications Ltd.. https://doi.org/10.4028/www.scientific.net/SSP.299.998

Vancouver

Makovskaya OY, Shevchuk A, Sorokinc SP. Copper recovery from rinse waters after ammoniac etching of printed circuit boards. In Radionov AA, editor, Materials Engineering and Technologies for Production and Processing V. Trans Tech Publications Ltd. 2020. p. 998-1004. (Solid State Phenomena). doi: 10.4028/www.scientific.net/SSP.299.998

Author

Makovskaya, O. Yu ; Shevchuk, A. ; Sorokinc, S. P. / Copper recovery from rinse waters after ammoniac etching of printed circuit boards. Materials Engineering and Technologies for Production and Processing V. editor / Andrey A. Radionov. Trans Tech Publications Ltd., 2020. pp. 998-1004 (Solid State Phenomena).

BibTeX

@inproceedings{3be87b57d4b54116874f1d3574eec09e,
title = "Copper recovery from rinse waters after ammoniac etching of printed circuit boards",
keywords = "Ammonia, Copper, Ion exchange, Printed circuit boards, Rinse waters",
author = "Makovskaya, {O. Yu} and A. Shevchuk and Sorokinc, {S. P.}",
year = "2020",
month = jan,
day = "1",
doi = "10.4028/www.scientific.net/SSP.299.998",
language = "English",
isbn = "9783035715002",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications Ltd.",
pages = "998--1004",
editor = "Radionov, {Andrey A.}",
booktitle = "Materials Engineering and Technologies for Production and Processing V",
address = "Switzerland",
note = "5th International Conference on Industrial Engineering,ICIE 2019 ; Conference date: 25-03-2019 Through 29-03-2019",

}

RIS

TY - GEN

T1 - Copper recovery from rinse waters after ammoniac etching of printed circuit boards

AU - Makovskaya, O. Yu

AU - Shevchuk, A.

AU - Sorokinc, S. P.

PY - 2020/1/1

Y1 - 2020/1/1

KW - Ammonia

KW - Copper

KW - Ion exchange

KW - Printed circuit boards

KW - Rinse waters

UR - http://www.scopus.com/inward/record.url?scp=85079884225&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/SSP.299.998

DO - 10.4028/www.scientific.net/SSP.299.998

M3 - Conference contribution

AN - SCOPUS:85079884225

SN - 9783035715002

T3 - Solid State Phenomena

SP - 998

EP - 1004

BT - Materials Engineering and Technologies for Production and Processing V

A2 - Radionov, Andrey A.

PB - Trans Tech Publications Ltd.

T2 - 5th International Conference on Industrial Engineering,ICIE 2019

Y2 - 25 March 2019 through 29 March 2019

ER -

ID: 12225641