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Vlasova, AM 2020,
Parallel computing for the simulation of deformation of hexagonal close-packed crystal (HCP). в VE Panin & VM Fomin (ред.),
Proceedings of the International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology., 020349, AIP Conference Proceedings, Том. 2310, American Institute of Physics Inc., International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology 2020, Tomsk, Российская Федерация,
05/10/2020.
https://doi.org/10.1063/5.0034508
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@inproceedings{a5f8a1bbb06d4b5fad48515da2054d75,
title = "Parallel computing for the simulation of deformation of hexagonal close-packed crystal (HCP)",
author = "Vlasova, {A. M.}",
year = "2020",
month = dec,
day = "14",
doi = "10.1063/5.0034508",
language = "English",
series = "AIP Conference Proceedings",
publisher = "American Institute of Physics Inc.",
editor = "Panin, {Victor E.} and Fomin, {Vasily M.}",
booktitle = "Proceedings of the International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology",
address = "United States",
note = "International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology 2020 ; Conference date: 05-10-2020 Through 09-10-2020",
}
RIS
TY - GEN
T1 - Parallel computing for the simulation of deformation of hexagonal close-packed crystal (HCP)
AU - Vlasova, A. M.
PY - 2020/12/14
Y1 - 2020/12/14
UR - http://www.scopus.com/inward/record.url?scp=85098000208&partnerID=8YFLogxK
UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000679378000250
U2 - 10.1063/5.0034508
DO - 10.1063/5.0034508
M3 - Conference contribution
AN - SCOPUS:85098000208
T3 - AIP Conference Proceedings
BT - Proceedings of the International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology
A2 - Panin, Victor E.
A2 - Fomin, Vasily M.
PB - American Institute of Physics Inc.
T2 - International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology 2020
Y2 - 5 October 2020 through 9 October 2020
ER -