Standard

Electronic transport in equiatomic CuZrNiTi alloy. / Uporov, S.; Bykov, V.; Estemirova, S. и др.
в: Journal of Alloys and Compounds, Том 770, 05.01.2019, стр. 1164-1172.

Результаты исследований: Вклад в журнал › Статья › Рецензирование

Harvard

Uporov, S, Bykov, V, Estemirova, S, Melchakov, S & Ryltsev, R 2019, 'Electronic transport in equiatomic CuZrNiTi alloy', Journal of Alloys and Compounds, Том. 770, стр. 1164-1172. https://doi.org/10.1016/j.jallcom.2018.08.225

APA

Uporov, S., Bykov, V., Estemirova, S., Melchakov, S., & Ryltsev, R. (2019). Electronic transport in equiatomic CuZrNiTi alloy. Journal of Alloys and Compounds, 770, 1164-1172. https://doi.org/10.1016/j.jallcom.2018.08.225

Vancouver

Uporov S, Bykov V, Estemirova S, Melchakov S, Ryltsev R. Electronic transport in equiatomic CuZrNiTi alloy. Journal of Alloys and Compounds. 2019 янв. 5;770:1164-1172. doi: 10.1016/j.jallcom.2018.08.225

Author

Uporov, S. ; Bykov, V. ; Estemirova, S. и др. / Electronic transport in equiatomic CuZrNiTi alloy. в: Journal of Alloys and Compounds. 2019 ; Том 770. стр. 1164-1172.

BibTeX

@article{6a789ad7bb2449bf8ddc790a43efb8ed,
title = "Electronic transport in equiatomic CuZrNiTi alloy",
keywords = "Electrical conductivity, Electron microscopy, Electronic transport properties, Heat capacity, High-entropy alloys, Structure, Thermal expansion, SYSTEM, FORMING ABILITY, TEMPERATURE-DEPENDENCE, BEHAVIOR, THERMAL-CONDUCTIVITY, MECHANICAL-PROPERTIES, ELECTRICAL-RESISTIVITY, SUPERCOOLED LIQUID REGION, CU-ZR BINARY, BULK METALLIC-GLASS",
author = "S. Uporov and V. Bykov and S. Estemirova and S. Melchakov and R. Ryltsev",
year = "2019",
month = jan,
day = "5",
doi = "10.1016/j.jallcom.2018.08.225",
language = "English",
volume = "770",
pages = "1164--1172",
journal = "Journal of Alloys and Compounds",
issn = "0925-8388",
publisher = "Elsevier Inc.",

}

RIS

TY - JOUR

T1 - Electronic transport in equiatomic CuZrNiTi alloy

AU - Uporov, S.

AU - Bykov, V.

AU - Estemirova, S.

AU - Melchakov, S.

AU - Ryltsev, R.

PY - 2019/1/5

Y1 - 2019/1/5

KW - Electrical conductivity

KW - Electron microscopy

KW - Electronic transport properties

KW - Heat capacity

KW - High-entropy alloys

KW - Structure

KW - Thermal expansion

KW - SYSTEM

KW - FORMING ABILITY

KW - TEMPERATURE-DEPENDENCE

KW - BEHAVIOR

KW - THERMAL-CONDUCTIVITY

KW - MECHANICAL-PROPERTIES

KW - ELECTRICAL-RESISTIVITY

KW - SUPERCOOLED LIQUID REGION

KW - CU-ZR BINARY

KW - BULK METALLIC-GLASS

UR - http://www.scopus.com/inward/record.url?scp=85052472609&partnerID=8YFLogxK

UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000449486300137

U2 - 10.1016/j.jallcom.2018.08.225

DO - 10.1016/j.jallcom.2018.08.225

M3 - Article

AN - SCOPUS:85052472609

VL - 770

SP - 1164

EP - 1172

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

SN - 0925-8388

ER -

ID: 7757045