Standard

A single-phase ScTiZrHf high-entropy alloy with thermally stable hexagonal close-packed structure. / Uporov, S.; Estemirova, S. Kh; Bykov, V. A. и др.
в: Intermetallics, Том 122, 106802, 07.2020.

Результаты исследований: Вклад в журнал › Статья › Рецензирование

Harvard

Uporov, S, Estemirova, SK, Bykov, VA, Zamyatin, DA & Ryltsev, RE 2020, 'A single-phase ScTiZrHf high-entropy alloy with thermally stable hexagonal close-packed structure', Intermetallics, Том. 122, 106802. https://doi.org/10.1016/j.intermet.2020.106802

APA

Uporov, S., Estemirova, S. K., Bykov, V. A., Zamyatin, D. A., & Ryltsev, R. E. (2020). A single-phase ScTiZrHf high-entropy alloy with thermally stable hexagonal close-packed structure. Intermetallics, 122, [106802]. https://doi.org/10.1016/j.intermet.2020.106802

Vancouver

Uporov S, Estemirova SK, Bykov VA, Zamyatin DA, Ryltsev RE. A single-phase ScTiZrHf high-entropy alloy with thermally stable hexagonal close-packed structure. Intermetallics. 2020 июль;122:106802. doi: 10.1016/j.intermet.2020.106802

Author

Uporov, S. ; Estemirova, S. Kh ; Bykov, V. A. и др. / A single-phase ScTiZrHf high-entropy alloy with thermally stable hexagonal close-packed structure. в: Intermetallics. 2020 ; Том 122.

BibTeX

@article{73a56cc4fae6489dac81ccfee4f7f349,
title = "A single-phase ScTiZrHf high-entropy alloy with thermally stable hexagonal close-packed structure",
keywords = "Ab-initio simulation, Electrical conductivity, Hexagonal structure, High-entropy alloy, Magnetization, Microstructure, Molecular dynamics, Thermal conductivity, STRATEGY",
author = "S. Uporov and Estemirova, {S. Kh} and Bykov, {V. A.} and Zamyatin, {D. A.} and Ryltsev, {R. E.}",
year = "2020",
month = jul,
doi = "10.1016/j.intermet.2020.106802",
language = "English",
volume = "122",
journal = "Intermetallics",
issn = "0966-9795",
publisher = "Elsevier",

}

RIS

TY - JOUR

T1 - A single-phase ScTiZrHf high-entropy alloy with thermally stable hexagonal close-packed structure

AU - Uporov, S.

AU - Estemirova, S. Kh

AU - Bykov, V. A.

AU - Zamyatin, D. A.

AU - Ryltsev, R. E.

PY - 2020/7

Y1 - 2020/7

KW - Ab-initio simulation

KW - Electrical conductivity

KW - Hexagonal structure

KW - High-entropy alloy

KW - Magnetization

KW - Microstructure

KW - Molecular dynamics

KW - Thermal conductivity

KW - STRATEGY

UR - http://www.scopus.com/inward/record.url?scp=85083000621&partnerID=8YFLogxK

UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000534583600004

U2 - 10.1016/j.intermet.2020.106802

DO - 10.1016/j.intermet.2020.106802

M3 - Article

AN - SCOPUS:85083000621

VL - 122

JO - Intermetallics

JF - Intermetallics

SN - 0966-9795

M1 - 106802

ER -

ID: 12651244