Electrodeposition of copper on metal-filled composite support

Standard

Electrodeposition of copper on metal-filled composite support. / Rudoi, V. M.; Ostanina, T. N.; Darintseva, A. B. et al.
In: Russian Journal of Electrochemistry, Vol. 46, No. 6, 01.06.2010, p. 702-706.

Research output: Contribution to journal › Article › peer-review

BibTeX

@article{d6f65df3a48e41ddb303c0559fdc33c7,

title = "Electrodeposition of copper on metal-filled composite support",

keywords = "Copper deposit, Electrocrystallization, Galvanostatic conditions, Kinetic parameters, Mathematic model, Metal-filled composite",

author = "Rudoi, {V. M.} and Ostanina, {T. N.} and Darintseva, {A. B.} and Ostanin, {N. I.} and Alikhanova, {I. A.} and Demakov, {S. L.} and Prokof'eva, {A. S.}",

year = "2010",

month = jun,

day = "1",

doi = "10.1134/S1023193510060157",

language = "English",

volume = "46",

pages = "702--706",

journal = "Russian Journal of Electrochemistry",

issn = "1023-1935",

publisher = "Pleiades Publishing",

number = "6",

}

RIS

TY - JOUR

T1 - Electrodeposition of copper on metal-filled composite support

AU - Rudoi, V. M.

AU - Ostanina, T. N.

AU - Darintseva, A. B.

AU - Ostanin, N. I.

AU - Alikhanova, I. A.

AU - Demakov, S. L.

AU - Prokof'eva, A. S.

PY - 2010/6/1

Y1 - 2010/6/1

KW - Copper deposit

KW - Electrocrystallization

KW - Galvanostatic conditions

KW - Kinetic parameters

KW - Mathematic model

KW - Metal-filled composite

UR - http://www.scopus.com/inward/record.url?scp=77955902342&partnerID=8YFLogxK

UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000279435100015

U2 - 10.1134/S1023193510060157

DO - 10.1134/S1023193510060157

M3 - Article

AN - SCOPUS:77955902342

VL - 46

SP - 702

EP - 706

JO - Russian Journal of Electrochemistry

JF - Russian Journal of Electrochemistry

SN - 1023-1935

IS - 6

ER -

ID: 8504999