Electrodeposition of copper on metal-filled composite support

Original language	English
Pages (from-to)	702-706
Number of pages	5
Journal	Russian Journal of Electrochemistry
Volume	46
Issue number	6
DOIs	https://doi.org/10.1134/S1023193510060157
Publication status	Published - 1 Jun 2010

Copper deposit, Electrocrystallization, Galvanostatic conditions, Kinetic parameters, Mathematic model, Metal-filled composite

ID: 8504999