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Activation of surfaces of dielectric materials with copper(I) solutions. / Brusnitsyna, L. A.; Makurin, Yu. N.
In: Russian Journal of Applied Chemistry, Vol. 72, No. 2, 1999, p. 238 - 240.

Research output: Contribution to journal › Article › peer-review

Harvard

Brusnitsyna, LA & Makurin, YN 1999, 'Activation of surfaces of dielectric materials with copper(I) solutions', Russian Journal of Applied Chemistry, vol. 72, no. 2, pp. 238 - 240.

APA

Brusnitsyna, L. A., & Makurin, Y. N. (1999). Activation of surfaces of dielectric materials with copper(I) solutions. Russian Journal of Applied Chemistry, 72(2), 238 - 240.

Vancouver

Brusnitsyna LA, Makurin YN. Activation of surfaces of dielectric materials with copper(I) solutions. Russian Journal of Applied Chemistry. 1999;72(2):238 - 240.

Author

Brusnitsyna, L. A. ; Makurin, Yu. N. / Activation of surfaces of dielectric materials with copper(I) solutions. In: Russian Journal of Applied Chemistry. 1999 ; Vol. 72, No. 2. pp. 238 - 240.

BibTeX

@article{9976a5e4ab8b4885ac0049640eeeb80e,
title = "Activation of surfaces of dielectric materials with copper(I) solutions",
abstract = "The possibility of using solutions based on copper(I) chloride to activate surfaces of dielectric materials was studied. The composition of activating solution was developed. Acceleration solutions based on sodium hypophosphite, hydroxylamine hydrochloride, hydrazine chloride, and formaldehyde were studied. The effect of the composition of activating solution on the quality of metal coating and its adhesion to a dielectric was determined. The stability over time of various activating solutions was studied.",
author = "Brusnitsyna, {L. A.} and Makurin, {Yu. N.}",
year = "1999",
language = "English",
volume = "72",
pages = "238 -- 240",
journal = "Russian Journal of Applied Chemistry",
issn = "1070-4272",
publisher = "Pleiades Publishing",
number = "2",

}

RIS

TY - JOUR

T1 - Activation of surfaces of dielectric materials with copper(I) solutions

AU - Brusnitsyna, L. A.

AU - Makurin, Yu. N.

PY - 1999

Y1 - 1999

N2 - The possibility of using solutions based on copper(I) chloride to activate surfaces of dielectric materials was studied. The composition of activating solution was developed. Acceleration solutions based on sodium hypophosphite, hydroxylamine hydrochloride, hydrazine chloride, and formaldehyde were studied. The effect of the composition of activating solution on the quality of metal coating and its adhesion to a dielectric was determined. The stability over time of various activating solutions was studied.

AB - The possibility of using solutions based on copper(I) chloride to activate surfaces of dielectric materials was studied. The composition of activating solution was developed. Acceleration solutions based on sodium hypophosphite, hydroxylamine hydrochloride, hydrazine chloride, and formaldehyde were studied. The effect of the composition of activating solution on the quality of metal coating and its adhesion to a dielectric was determined. The stability over time of various activating solutions was studied.

UR - http://www.scopus.com/inward/record.url?partnerID=8YFLogxK&scp=27844576890

UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000081041800013

M3 - Article

VL - 72

SP - 238

EP - 240

JO - Russian Journal of Applied Chemistry

JF - Russian Journal of Applied Chemistry

SN - 1070-4272

IS - 2

ER -

ID: 56321040