The possibility of using solutions based on copper(I) chloride to activate surfaces of dielectric materials was studied. The composition of activating solution was developed. Acceleration solutions based on sodium hypophosphite, hydroxylamine hydrochloride, hydrazine chloride, and formaldehyde were studied. The effect of the composition of activating solution on the quality of metal coating and its adhesion to a dielectric was determined. The stability over time of various activating solutions was studied.