To the issue of low-alloyed copper alloys for contact wires

Original language	English
Title of host publication	Materials Engineering and Technologies for Production and Processing VII
Editors	Andrey A. Radionov
Publisher	Trans Tech Publications Ltd.
Pages	179-184
Number of pages	6
Volume	410 DDF
ISBN (Print)	9783035718409
DOIs	https://doi.org/10.4028/www.scientific.net/DDF.410.179
Publication status	Published - 2021
Event	7th International Conference on Industrial Engineering, ICIE 2021 - Virtual, Online Duration: 17 May 2021 → 21 May 2021

Conference	7th International Conference on Industrial Engineering, ICIE 2021
City	Virtual, Online
Period	17/05/2021 → 21/05/2021

Copper alloy, Electrical resistivity, Mechanical properties, Overhead contact wire, Recrystallization temperature

ID: 23739188