The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices › Research Explorer

The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

Research output: Contribution to journal › Article › peer-review

DOI

https://doi.org/10.1134/S1061830913030078
Final published version

Original language	English
Pages (from-to)	178-183
Number of pages	6
Journal	Russian Journal of Nondestructive Testing
Volume	49
Issue number	3
DOIs	https://doi.org/10.1134/S1061830913030078
Publication status	Published - Mar 2013

WoS ResearchAreas Categories

Materials Science, Characterization & Testing

Research areas

defect, quality, diagnostics, comparison, heat transfer, soldering

ASJC Scopus subject areas

Mechanical Engineering
Mechanics of Materials
Condensed Matter Physics
Materials Science(all)

ID: 912570