Standard

Study of substrate thickness influence on effectiveness of miniaturization, based on implementation of artificial transmission lines. / Letavin, Denis A.
2017 25TH TELECOMMUNICATION FORUM (TELFOR). Vol. 2017-January IEEE Computer Society, 2017. p. 434-436.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Harvard

Letavin, DA 2017, Study of substrate thickness influence on effectiveness of miniaturization, based on implementation of artificial transmission lines. in 2017 25TH TELECOMMUNICATION FORUM (TELFOR). vol. 2017-January, IEEE Computer Society, pp. 434-436, 25th Telecommunications Forum, TELFOR 2017, Belgrade, Serbia, 21/11/2017. https://doi.org/10.1109/TELFOR.2017.8249379

APA

Letavin, D. A. (2017). Study of substrate thickness influence on effectiveness of miniaturization, based on implementation of artificial transmission lines. In 2017 25TH TELECOMMUNICATION FORUM (TELFOR) (Vol. 2017-January, pp. 434-436). IEEE Computer Society. https://doi.org/10.1109/TELFOR.2017.8249379

Vancouver

Letavin DA. Study of substrate thickness influence on effectiveness of miniaturization, based on implementation of artificial transmission lines. In 2017 25TH TELECOMMUNICATION FORUM (TELFOR). Vol. 2017-January. IEEE Computer Society. 2017. p. 434-436 doi: 10.1109/TELFOR.2017.8249379

Author

Letavin, Denis A. / Study of substrate thickness influence on effectiveness of miniaturization, based on implementation of artificial transmission lines. 2017 25TH TELECOMMUNICATION FORUM (TELFOR). Vol. 2017-January IEEE Computer Society, 2017. pp. 434-436

BibTeX

@inproceedings{a663d2b1d76c4c48b22c47f533335497,
title = "Study of substrate thickness influence on effectiveness of miniaturization, based on implementation of artificial transmission lines",
keywords = "miniaturization, microstrip line, artificial transmission line, directional coupler, BRANCH-LINE, COMPACT-SIZE, RAT-RACE, COUPLERS",
author = "Letavin, {Denis A.}",
year = "2017",
doi = "10.1109/TELFOR.2017.8249379",
language = "English",
volume = "2017-January",
pages = "434--436",
booktitle = "2017 25TH TELECOMMUNICATION FORUM (TELFOR)",
publisher = "IEEE Computer Society",
address = "United States",
note = "25th Telecommunications Forum, TELFOR 2017 ; Conference date: 21-11-2017 Through 22-11-2017",

}

RIS

TY - GEN

T1 - Study of substrate thickness influence on effectiveness of miniaturization, based on implementation of artificial transmission lines

AU - Letavin, Denis A.

PY - 2017

Y1 - 2017

KW - miniaturization

KW - microstrip line

KW - artificial transmission line

KW - directional coupler

KW - BRANCH-LINE

KW - COMPACT-SIZE

KW - RAT-RACE

KW - COUPLERS

UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000427782600106

UR - http://www.scopus.com/inward/record.url?scp=85045760332&partnerID=8YFLogxK

UR - https://elibrary.ru/item.asp?id=35520309

U2 - 10.1109/TELFOR.2017.8249379

DO - 10.1109/TELFOR.2017.8249379

M3 - Conference contribution

VL - 2017-January

SP - 434

EP - 436

BT - 2017 25TH TELECOMMUNICATION FORUM (TELFOR)

PB - IEEE Computer Society

T2 - 25th Telecommunications Forum, TELFOR 2017

Y2 - 21 November 2017 through 22 November 2017

ER -

ID: 7035626