Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems › Research Explorer

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Research output: Contribution to journal › Article › peer-review

DOI

https://doi.org/10.1108/SSMT-07-2020-0029
Final published version

Waluyo Adi Siswanto
Kirill Borodin
Zaid Hamid Mahmoud
A. Surendar
Sami Sajjadifar
Galiya Abdilova
Jun Chang

Original language	English
Pages (from-to)	232-239
Number of pages	8
Journal	Soldering and Surface Mount Technology
Volume	33
Issue number	4
DOIs	https://doi.org/10.1108/SSMT-07-2020-0029
Publication status	Published - 12 Jul 2021

WoS ResearchAreas Categories

Engineering, Manufacturing
Engineering, Electrical & Electronic
Materials Science, Multidisciplinary
Metallurgy & Metallurgical Engineering

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Electrical and Electronic Engineering

Research areas

Aging temperature, Solder joint, Thermal fatigue, Thermomechanical fatigue model

ID: 22821358