Diffusion coefficients have been measured within the 1473-1623 K temperature range. Apparent diffusion activation energies have been measured for studied melts using these data, which are equal to 52, 86 and 108 kJ/mole, respectively. Chromium addition noticeably decreases components diffusion rate due to the formation of stronger chromium-boron bonds. This effect is even more appreciable in supercooled melts. The considerable diffusion retardations in ternary systems promote an amorphous structure generation. This conclusion is confirmed by practical results on the preparation of amorphous solders on a nickel base.