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Additional Miniaturization of Directional Couplers. / Letavin, Denis A.
30th Telecommunications Forum, TELFOR 2022, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. p. 1-3 (Telecommunications Forum, TELFOR 2022, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Harvard

Letavin, DA 2022, Additional Miniaturization of Directional Couplers. in 30th Telecommunications Forum, TELFOR 2022, Proceedings. Telecommunications Forum, TELFOR 2022, Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 2022 30th Telecommunications Forum (TELFOR), 15/11/2022. https://doi.org/10.1109/TELFOR56187.2022.9983701

APA

Letavin, D. A. (2022). Additional Miniaturization of Directional Couplers. In 30th Telecommunications Forum, TELFOR 2022, Proceedings (pp. 1-3). (Telecommunications Forum, TELFOR 2022, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TELFOR56187.2022.9983701

Vancouver

Letavin DA. Additional Miniaturization of Directional Couplers. In 30th Telecommunications Forum, TELFOR 2022, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2022. p. 1-3. (Telecommunications Forum, TELFOR 2022, Proceedings). doi: 10.1109/TELFOR56187.2022.9983701

Author

Letavin, Denis A. / Additional Miniaturization of Directional Couplers. 30th Telecommunications Forum, TELFOR 2022, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 1-3 (Telecommunications Forum, TELFOR 2022, Proceedings).

BibTeX

@inproceedings{cdba16c9ea6748e9b0957c818db78f4a,
title = "Additional Miniaturization of Directional Couplers",
abstract = "A technique for increasing the degree of miniaturization of microstrip directional couplers is described, provided that the initially unused area inside the device is fully utilized. At the same time, from the side of the metallized surface under the capacitive elements of the low-pass filters, cavities are made with a depth not exceeding the thickness of the substrate, while the walls of the cavities have a metallized layer. This makes it possible to reduce the thickness of the substrate under the capacitive elements and thereby increase the capacitance rating for the same element area on the printed circuit board. This approach makes it possible in some cases to avoid the use of multilayer printed circuit boards, which simplifies the design of the device. {\textcopyright} 2022 IEEE.",
author = "Letavin, {Denis A.}",
year = "2022",
doi = "10.1109/TELFOR56187.2022.9983701",
language = "English",
series = "Telecommunications Forum, TELFOR 2022, Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--3",
booktitle = "30th Telecommunications Forum, TELFOR 2022, Proceedings",
address = "United States",
note = "2022 30th Telecommunications Forum (TELFOR) ; Conference date: 15-11-2022 Through 16-11-2022",

}

RIS

TY - GEN

T1 - Additional Miniaturization of Directional Couplers

AU - Letavin, Denis A.

PY - 2022

Y1 - 2022

N2 - A technique for increasing the degree of miniaturization of microstrip directional couplers is described, provided that the initially unused area inside the device is fully utilized. At the same time, from the side of the metallized surface under the capacitive elements of the low-pass filters, cavities are made with a depth not exceeding the thickness of the substrate, while the walls of the cavities have a metallized layer. This makes it possible to reduce the thickness of the substrate under the capacitive elements and thereby increase the capacitance rating for the same element area on the printed circuit board. This approach makes it possible in some cases to avoid the use of multilayer printed circuit boards, which simplifies the design of the device. © 2022 IEEE.

AB - A technique for increasing the degree of miniaturization of microstrip directional couplers is described, provided that the initially unused area inside the device is fully utilized. At the same time, from the side of the metallized surface under the capacitive elements of the low-pass filters, cavities are made with a depth not exceeding the thickness of the substrate, while the walls of the cavities have a metallized layer. This makes it possible to reduce the thickness of the substrate under the capacitive elements and thereby increase the capacitance rating for the same element area on the printed circuit board. This approach makes it possible in some cases to avoid the use of multilayer printed circuit boards, which simplifies the design of the device. © 2022 IEEE.

UR - http://www.scopus.com/inward/record.url?partnerID=8YFLogxK&scp=85146245573

U2 - 10.1109/TELFOR56187.2022.9983701

DO - 10.1109/TELFOR56187.2022.9983701

M3 - Conference contribution

T3 - Telecommunications Forum, TELFOR 2022, Proceedings

SP - 1

EP - 3

BT - 30th Telecommunications Forum, TELFOR 2022, Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 30th Telecommunications Forum (TELFOR)

Y2 - 15 November 2022 through 16 November 2022

ER -

ID: 33989961