The opportunity to perform multilayered screening platings from acetate solutions by means of “one bath method” depends on pH value. The calculations have shown that when pH rises from 2.5 to 5.5 in solution 0.03 Mol/l in the presence of HAc the part of anion complexes arises with the ligands quantity 3 and 4. It is experimentally established that the growth of the anion copper complexes part leads to minimizing the exchange current of copper ions reduction. The limiting diffusion current in solution with рН 2.5 more than double exceeds the limiting current at the higher pH. Multilayered platings of copper and nickel were received from acetate solution by pulse mode of electrolysis.