FIELD: chemistry.
SUBSTANCE: lead selenide films are deposited on a substrate of dielectric materials from aqueous solutions containing a salt of lead (II), ethylenediamine, ammonium acetate, selenourea, ascorbic acid in an amount of 0.001-0.01 mol/l being introduced into the solution during the deposition as an antioxidant for selenourea, with the subsequent heat treatment of the deposited films in air at 503-583 K.
EFFECT: increasing the photosensitivity of lead selenide films to IR-radiation, reducing the sensitizing heat treatment temperature by 90-140 K.