In a comparison of the deformation behavior under uniaxial compression of the composite material based on bis-GMA, UDMA, TEGDMA, PEGDMA and bis-EMA with the silicon and zirconium filler to create an adhesive connection and without adhesive compound. Describes the changes in the deformation behavior of each deformation curve. It is shown that the compound alters the adhesive strength characteristics of the sample due to the difference of Poisson's ratio of the materials.